منابع مشابه
The Effect of Micro-Alloying of Sn Plating on Mitigation of Sn Whisker Growth
Tin (Sn) is a key industrial material in coatings on various components in the electronics industry. However, Sn is prone to the development of filament-like whiskers, which is the leading cause of many types of damage to electronics reported in the last several decades. Due to its properties, a tin-lead (Sn-Pb) alloy coating can mitigate Sn whisker growth. However, the demand for Pb-free surfa...
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ژورنال
عنوان ژورنال: Materials Letters: X
سال: 2020
ISSN: 2590-1508
DOI: 10.1016/j.mlblux.2020.100045